CyberOptics Corporation (Nasdaq: CYBE) today announced that it introduced its advanced, next-generation SE500 solder paste inspection system at the APEX 2009 Exhibition in Las Vegas. The SE500 also will be on display at the upcoming NEPCON Exhibition in Shanghai later this month.

Based on a cost-reduced platform, the SE500 will be the fastest solder paste inspection system on the market, capable of inspecting the smallest electronic components now in use without compromising measurement accuracy and repeatability. The SE500 product line includes two models that accommodate different SMT circuit board sizes, up to 32” X 24”. This makes the SE500 capable of inspecting the largest boards among CyberOptics’ primary competitors. In addition, the SE500 incorporates calibration-free sensor technology. By eliminating the need to recalibrate the system in the customer’s factory, this capability reduces the system’s cost of ownership. Later in 2009, a dual conveyor enhancement is scheduled for introduction, which will enable the SE500 to simultaneously inspect circuit boards from two production lines.

CyberOptics said it has booked its initial SE500 orders, which are expected to ship in this year’s second quarter. SE500 manufacturing is underway at CyberOptics’ new facility in Singapore.

Kathleen P. Iverson, president and chief executive officer, commented: “The SE500 generated significant customer interest at the APEX trade show, making us optimistic about the revenue-generating potential of this next-generation system. Given its industry-leading inspection capabilities, we believe the SE500 will command improved pricing in comparison to the SE300 that it is replacing, while enabling CyberOptics to gain a larger share of the global solder paste inspection market.”

About CyberOptics

Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. Our products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. By increasing productivity and product quality, our sensors and inspection systems enable electronics manufacturers to strengthen their competitive positions in highly price-sensitive markets. Headquartered in Minneapolis, Minnesota, we conduct worldwide operations through facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the impact of current economic conditions on the Company’s performance; the timing and magnitude of any potential recovery in financial performance resulting from the global economic downturn; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; unanticipated costs or delays associated with the transition of manufacturing for SMT Systems to Singapore; a change in our anticipated timing of Assembleon’s transition away from our alignment sensors, success of anticipated new OEM and end user opportunities and other factors set forth in the Company’s filings with the Securities and Exchange Commission.