CyberOptics Introduces New WaferSense® and ReticleSense® Auto Multi Sensors (AMS)
CyberOptics® Corporation (NASDAQ:CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces the first wireless sensor to combine leveling, vibration and humidity measurement in an all-in-one multi sensor, available in both WaferSense® or ReticleSense® form factors.
Semiconductor fabs and OEMs worldwide have adopted the wireless WaferSense and ReticleSense measurement devices to enable improvements in fab yields and equipment uptime. The new Auto Multi Sensor (AMS) line, a new addition to the portfolio, will be on display at SEMICON West 2015, the premier annual event for the global semiconductor industry, in San Francisco July 14-16, 2015, booth #2511.
“Our customers value the leveling and vibration devices for precise and accurate measurements in the fab environment,” said Subodh Kulkarni, President and CEO of CyberOptics. “We have also learned that equipment and process engineers often use these two devices in conjunction with each other. In order to make this even more convenient, we have developed an all-in-one solution that is thinner and lighter weight for ease of travel through any tool.”
CyberOptics has also added a Relative Humidity (RH) measurement capability to the AMS devices. RH is becoming increasingly more important in many processes such as controlling the amount of oxidization on the wafer or electro-static discharge (ESD) issues in the fab. This versatile solution is a combination sensor capable of multiple measurements now available in one convenient device.
About the WaferSense and ReticleSense Line
The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm, 300mm and 450mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ), the Auto Leveling System (ALSR) and the new Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.
For more information about the entire line of CyberOptics solutions please visit the company’s website at www.cyberoptics.com.
CyberOptics Corporation (NASDAQ:CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI; forecasts for at least 10% growth in sales and break-even operating results for 2015 and other factors set forth in the Company’s filings with the Securities and Exchange Commission.
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