CyberOptics Corporation (Nasdaq: CYBE) today announced that it has introduced a comprehensive set of WaferSense offerings to support the semiconductor industry’s new 450mm wafer initiative and thus position this product line for ongoing growth.

Mark Hannaford, global sales director for CyberOptics’ semiconductor products, commented: “The WaferSense family is comprised of five models, all of which are now available in 450mm, including AGS for chamber gap measurement, ALS for leveling, ATS for robot teaching, AVS for vibration measurement and APS for particle detection.”

He continued, “WaferSense products for 200mm and 300mm wafers have been available since 2004. These unique, proprietary products are used by most fabs and OEMs, including the three largest chip manufacturers, to improve yield and tool uptime. The confidence of our customers in WaferSense products has been demonstrated over the years through significant recurring orders.”

WaferSense products are wireless, wafer-shaped, real-time measurement devices that travel through fabrication tools like the actual wafers do. Measurements are reported via Bluetooth communication to allow for in-situ real-time adjustments.

About CyberOptics
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. Our products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. By increasing productivity and product quality, our sensors and inspection systems enable electronics manufacturers to strengthen their competitive positions in highly price-sensitive markets. Headquartered in Minneapolis, Minnesota, we conduct worldwide operations through facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we achieve in the remainder of 2013; the level of revenue and profit or loss we achieve in 2014; success of anticipated new OEM and end-user opportunities; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.