CyberOptics Corporation (Nasdaq: CYBE) today announced that its embedded process verification, or EPV™, inspection technology has been incorporated into the KE-2070 robotic assembly platform designed and manufactured by JUKI Corporation, a Tokyo-based company.

Equipped with CyberOptics’ EPV inspection technology, JUKI’s KE-2070 is the industry’s first robotic assembly machine capable of inspecting for the presence or absence of electronic components on SMT circuit boards immediately following their placement. With EPV inspection technology, JUKI’s KE-2070 platform is the only system in the world that can visualize feeder action during the electronic component placement process with images of both component pick and placement and movie mode. EPV technology also provides line engineers with a tool for root cause failure analysis during the assembly process to improve circuit board yields and minimize costly rework or scrap.

CyberOptics’ EPV technology is comprised of six ultra small cameras mounted on a placement head for on-the-fly imaging with no cycle time penalty for the inspection process. It is the “Eyes” into the assembly process embedded within the JUKI platform. The resulting inspection for missing components on the SMT circuit board operates at the full placement speed of the KE-2070. The JUKI KE-2070 platform also will continue to deploy CyberOptics’ LaserAlign® component placement sensors to ensure that electronic components placed on the circuit board are properly aligned and positioned.

Kathleen P. Iverson, CyberOptics’ president, chief executive officer and chair, commented: “JUKI, a leading manufacturer of pick-and-place equipment, has been a valued customer for many years, and we are extremely pleased that our relationship is enabling JUKI to further strengthen its position on the leading edge of robotic assembly technology. By incorporating a limited form of circuit board inspection into the component placement process, EPV makes inspection affordable to a wider range of customers, who otherwise may not deploy full-function, stand-alone automated optical inspection (AOI) systems. For this reason, JUKI’s KE-2070 platform represents a highly cost-effective way to enhance the yields of SMT production lines and expand the worldwide market for inspection.”

Robert J. Black Jr. president and chief executive officer of JUKI Automation Systems, Inc of North America, added: “The introduction of our KE-2070 with EPV technology marks a new phase in JUKI’s long-established partnership with CyberOptics. Equipped with EPV technology, the KE-2070 is positioned to strengthen production line yields for a broader spectrum of customers. In addition, EPV’s “no programming” feature makes inspection more feasible for production lines with inexperienced operators. For these and other reasons, we believe the KE-2070 brings a winning combination of benefits to our customers around the globe.”

About CyberOptics
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. Our products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. By increasing productivity and product quality, our sensors and inspection systems enable electronics manufacturers to strengthen their competitive positions in highly price-sensitive markets. Headquartered in Minneapolis, Minnesota, we conduct worldwide operations through facilities in North America, Asia and Europe.

About JUKI
Tokyo-based JUKI is one of the world’s leading SMT placement companies with over 20,000 machines installed worldwide and a pioneer of the modular automated assembly line. JUKI has built it global image with a combination of high reliability machines and a reputation for world-class service and support that result in the lowest production costs for its customers.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the impact of current economic conditions on the Company’s performance; the timing and magnitude of any potential recovery in financial performance resulting from the global economic downturn; the need for a valuation allowance with respect to our deferred tax assets; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the timing of and our ultimate ability to return to profitability in 2010; success of anticipated new OEM and end user opportunities and other factors set forth in the Company’s filings with the Securities and Exchange Commission.