FORM 6-K
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549

Report of Foreign Private Issuer

Pursuant to Rule 13a-16 or 15d-16
of the Securities Exchange Act of 1934


October 31, 2008

Commission File Number    001-16125
   
   
Advanced Semiconductor Engineering, Inc.
( Exact name of Registrant as specified in its charter)
   
26 Chin Third Road
Nantze Export Processing Zone
Kaoshiung, Taiwan
Republic of China
(Address of principal executive offices)


Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F           Form 40-F ____

Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1):
____

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Indicate by check mark if the registrant is submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7):
____
 
 

 

 
Note: Regulation S-T Rule 101(b)(7) only permits the submission in paper of a Form 6-K if submitted to furnish a report or other document that the registrant foreign private issuer must furnish and make public under the laws of the jurisdiction in which the registrant is incorporated, domiciled or legally organized (the registrant's "home country"), or under the rules of the home country exchange on which the registrant's securities are traded, as long as the report or other document is not a press release, is not required to be and has not been distributed to the registrant's security holders, and, if discussing a material event, has already been the subject of a Form 6-K submission or other Commission filing on EDGAR.

Indicate by check mark whether by furnishing the information contained in this Form, the registrant is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.

Yes ___       No    X  

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Signatures

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


 
ADVANCED SEMICONDUCTOR
ENGINEERING, INC.
 
     
Date: October 31, 2008                                  By:   
/s/ Joseph Tung
 
                                                                     Name:   
Joseph Tung
 
                                                                       Title:   
Chief Financial Officer
 
 
 

 
 
Advanced Semiconductor Engineering, Inc. 
 
 
 
FOR IMMEDIATE RELEASE

Contact:
ASE, Inc.
Room 1901, No. 333, Section 1
Keelung Road, Taipei, Taiwan, 110
 
Tel: + 886.2.8780.5489
Fax: + 886.2.2757.6121
http://www.aseglobal.com
 
Joseph Tung, CFO / Vice President
Freddie Liu, Vice President
Allen Kan, Manager
ir@aseglobal.com
 
Clare Lin, Director (US Contact)
clare.lin@aseus.com
Tel: + 1.408.986.6524

ADVANCED SEMICONDUCTOR ENGINEERING, INC. REPORTS UNAUDITED CONSOLIDATED FINANCIAL RESULTS FOR THE THIRD-QUARTER OF 2008

Taipei, Taiwan, R.O.C., October 31, 2008 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) (“We”, “ASE”, or the “Company”), the world’s largest independent provider of IC packaging and testing services, today reported unaudited net revenues1 of NT$25,815 million for the third quarter of 2008 (3Q08), down 7% year-over-year and up 1% sequentially.  Net income for the quarter totaled NT$2,212 million, down from NT$4,225 million in 3Q07 and down from NT$2,412 million in 2Q08.  Diluted earnings per share for the quarter was NT$0.41 (or US$0.066 per ADS), compared to NT$0.76 for 3Q07 and NT$0.42 for 2Q08.


RESULTS OF OPERATIONS

3Q08 Results Highlights
l
Net revenue contribution from IC packaging operations (including module assembly), testing operations, and substrates sold to third parties was NT$20,127 million, NT$5,195 million and NT$493 million, respectively, and each represented approximately 78%, 20% and 2%, respectively, of total net revenues for the quarter.
 
l
Cost of revenues was NT$19,186 million, down 1% year-over-year and up 1% sequentially.
 
-
As a percentage of total net revenues, cost of revenues was 74% in 3Q08, up from 70% in 3Q07 and down from 75% in 2Q08.
 
-
Raw material cost totaled NT$7,370 million during the quarter, representing 29% of total net revenues, compared with NT$7,695 million and 30% of net revenues in the previous quarter.
 
-
Depreciation, amortization and rental expenses totaled NT$4,169 million during the quarter, up 2% year-over-year and up 5% sequentially.
 
l
Total operating expenses during 3Q08 were NT$2,733 million, including NT$925 million in R&D and NT$1,808 million in SG&A, compared with operating expenses of NT$2,928 million in 2Q08.  The sequential decrease was primarily attributable to bonuses paid to employees and compensation to directors and supervisors of one of our subsidiaries in 2Q08.  Total operating expenses as a percentage of net revenues for the current quarter were 11%, up from 8% in 3Q07 and relatively unchanged compared to 2Q08.
 

1 All financial information presented in this press release is unaudited, consolidated and prepared in accordance with accounting principles generally accepted in the Republic of China, or ROC GAAP.  Such financial information is generated internally by us, and has not been subjected to the same review and scrutiny, including internal auditing procedures and review by our independent auditors, to which we subject our audited consolidated financial statements, and may vary materially from the audited consolidated financial information for the same period.  Any evaluation of the financial information presented in this press release should also take into account our published audited consolidated financial statements and the notes to those statements.  In addition, the financial information presented is not necessarily indicative of our results for any future period.
 
1

 
l
Operating profit for the quarter totaled NT$3,896 million, up from NT$3,584 million in the previous quarter.  Operating margin increased to 15% in 3Q08 from 14% in 2Q8.
 
l
In terms of non-operating items:
 
-
Net interest expense was NT$421 million, up from NT$268 million a quarter ago primarily due to an increase in total bank loans.
 
-
Net exchange loss of NT$146 million was primarily attributable to exchange losses from the appreciation of the the U.S. dollar against the N.T. dollar.
 
-
Gain on equity-method investment of NT$69 million was primarily attributable to investment gain of NT$44 million from USI and investment gain of NT$27 million from Hung Ching Construction.
 
-
Other non-operating expenses of NT$244 million were primarily related to valuation loss from financial assets and loss from inventory provision adjustment. Together with other non-operating expenses, total non-operating expenses for the quarter were NT$742 million, compared to NT$280 million for 3Q07 and NT$22 million for 2Q08.
 
l
Income before tax was NT$3,154 million for 3Q08, compared with NT$3,562 million in the previous quarter.  We recorded an income tax expense of NT$777 million during the quarter, compared with an income tax expense of NT$779 million in 2Q08.  Minority interest was NT$165 million for 3Q08, down from NT$371 million in the previous quarter, primarily due to the completion of the ASE Test privatization transaction at the end of May.
 
l
In 3Q08, net income was NT$2,212 million, compared to net income of NT$4,225 million for 3Q07 and NT$2,412 million for 2Q08.
 
l
Our total number of shares outstanding at the end of the quarter was 5,681,934,764 shares, including treasury stock.  Our diluted EPS for 3Q08 was NT$0.41, or US$0.066 per ADS, based on 5,403,832,355 weighted average number of shares outstanding in 3Q08.


LIQUIDITY AND CAPITAL RESOURCES
l
As of September 30, 2008, our cash and other financial assets totaled NT$28,485 million, compared to NT$32,648 million as of June 30, 2008.
 
l
Capital expenditures in 3Q08 totaled US$98 million, of which US$53 million was used for IC packaging and US$45 million was used for testing.
 
l
As of September 30, 2008, we had total bank debts of NT$66,367 million, compared to NT$64,687 million as of June 30, 2008.  Total bank debts consisted of NT$10,956 million of revolving working capital loans, NT$2,958 million of the current portion of long-term debts, NT$1,375 million of current portion of bonds payable and NT$51,078 million of long-term debts.  Total unused credit lines were NT$68,732 million.
 
l
Current ratio as of September 30, 2008 was 1.62, compared to 1.24 as of June 30, 2008.  Net debt to equity ratio was 0.51 as of September 30, 2008.
 
l
Total number of employees was 30,511 as of September 30, 2008.


2




 
BUSINESS REVIEW

IC Packaging Services2
l
Net revenues generated from our IC packaging operations were NT$20,127 million during the quarter, down NT$1,517 million, or 7% year-over-year, and up NT$94 million, or 1% sequentially.
 
l
Net revenues from advanced substrate and leadframe-based packaging accounted for 89% of total IC packaging net revenues during the quarter, which equaled to the previous quarter.
 
l
Gross margin for our IC packaging operations was 21%, down 5% year-over-year and unchanged sequentially.
 
l
Capital expenditures for our IC packaging operations amounted to US$53 million during the quarter, of which US$39 million was used for wirebonding packaging capacity and US$14 million was used for wafer bumping and flip chip packaging equipment.
 
l
As of September 30, 2008, there were 8,436 wirebonders in operation. 17 wirebonders were added and 7 wirebonders were disposed of during the quarter.
 
l
Net revenues from flip chip packages and wafer bumping services accounted for 15% of total packaging net revenues, up 2 percentage points from the previous quarter.
 

Testing Services
l
Net revenues generated from our testing operations were NT$5,195 million, down NT$87 million, or 2% year-over-year, and up NT$93 million, or 2% sequentially.
 
l
Final testing contributed 80% to total testing net revenues, and was up 2% from the previous quarter.  Wafer sort contributed 18% to total testing net revenues, down 1 percentage point from the previous quarter.  Engineering testing contributed 2% to total testing net revenues, down 1 percentage point from the previous quarter.
 
l
Depreciation, amortization and rental expense associated with our testing operations amounted to NT$1,593 million, down from NT$1,517 million in 3Q07 and up from NT$1,475 million in 2Q08.
 
l
In 3Q08, gross margin for our testing operations was 36%, down 5 percentage points year-over-year and down 2 percentage points sequentially.
 
l
Capital spending on our testing operations amounted to US$45 million during the quarter.
 
l
As of September 30, 2008, there were 1,638 testers in operation.  71 testers were added and 55 testers were disposed of during the quarter.
 

Substrate Operations
l
PBGA substrate manufactured by ASE amounted to NT$2,281 million for the quarter, down NT$331 million, or 13% year-over-year, and up NT$120 million, or 6% from the previous quarter.  Of the total output of NT$2,281 million, NT$493 million was from sales to external customers.
 
l
Gross margin for substrate operations was 20% during the quarter, down 4 percentage points year-over-year and up 5 percentage points from the previous quarter.
 
l
In 3Q08, the Company’s internal substrate manufacturing operations supplied 62% (by value) of our total substrate requirements.
 
l
As of September 30, 2008, the Companys PBGA capacity was 52 million units per month.
 

Customers
l
Our five largest customers together accounted for approximately 27% of our total net revenues in 3Q08, compared to 26% in 3Q07 and 28% in 2Q08.  No single customer accounted for more than 10% of our total net revenues.
 
2 IC packaging services include module assembly services.
 
3

 
l
Our top 10 customers contributed 46% of our total net revenues during the quarter, compared to 43% in 3Q07 and 47% in 2Q08.
 
l
Our customers that are integrated device manufacturers, or IDMs, accounted for 40% of our total net revenues during the quarter, compared to 39% in 3Q07 and 41% in 2Q08.

About ASE,  Inc.
ASE, Inc. is the world's largest independent provider of IC packaging services and testing services, including front-end engineering testing, wafer probing and final testing services.  ASE, Inc.’s international customer base of more than 200 customers includes such leading names as ATI Technologies Inc., CSR plc, Freescale Semiconductor, Inc., MediaTek Inc., NEC Corporation, NVIDIA Corporation, NXP Semiconductors, Qualcomm Incorporated, RF Micro Devices Inc., STMicroelectronics N.V. and VIA Technologies, Inc.  With advanced technological capabilities and a global presence spanning Taiwan, Korea, Japan, Singapore, Malaysia and the United States, ASE, Inc. has established a reputation for reliable, high quality products and services. For more information, visit our website at http://www.aseglobal.com.

Safe Harbor Notice
This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding our future results of operations and business prospects.  Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release.  We were not involved in the preparation of these projections.  The words “anticipate”, “believe”, “estimate”, “expect”, “intend”, “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release.  Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor industry; demand for the outsourced semiconductor packaging and testing services we offer and for such outsourced services generally; the highly competitive semiconductor industry; our ability to introduce new packaging, interconnect materials and testing technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the ROC and the PRC; general economic and political conditions, including the recent global financial crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors.  For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2007 Annual Report on Form 20-F filed on June 30, 2008, as amended.

4

 
Supplemental Financial Information
 
Consolidated Operations
Amounts in NT$ Millions
3Q/08
2Q/08
3Q/07
Net Revenues
Revenues by End Application
25,815
25,610
27,733
     
Communication
44%
45%
44%
Computer
23%
24%
22%
Automotive and Consumer
33%
31%
33%
Others
0%
0%
1%
Revenues by Region
     
North America
55%
53%
49%
Europe
15%
13%
13%
Taiwan
18%
22%
22%
Japan
9%
8%
8%
Other Asia
3%
4%
8%
 
 
IC Packaging Services
Amounts in NT$ Millions
3Q/08
2Q/08
3Q/07
Net Revenues
Revenues by Packaging Type
20,127
20,033
21,644
     
Advanced substrate & leadframe based
89%
89%
88%
Traditional leadframe based
4%
4%
4%
Module assembly
4%
4%
5%
Others
3%
3%
3%
Capacity
     
CapEx (US$ Millions) *
53
71
83
Number of Wirebonders
8,436
8,426
7,649
 
 
Testing Services
Amounts in NT$ Millions
3Q/08
2Q/08
3Q/07
Net Revenues
Revenues by Testing Type
5,195
5,102
5,282
     
Final test
80%
78%
76%
Wafer sort
18%
19%
21%
Engineering test
2%
3%
3%
Capacity
     
CapEx (US$ Millions) *
45
56
55
Number of Testers
1,638
1,622
1,580
 
* Capital expenditure amounts exclude building construction costs.
 
 

 
Advanced Semiconductor Engineering, Inc.
Summary of Consolidated Income Statements Data
(In NT$ millions, except per share data)
(Unaudited)
 
   
For the three months ended
   
For the period ended
 
   
Sep. 30
2008
   
Jun. 30
2008
   
Sep. 30
2007
   
Sep. 30
2008
   
Sep. 30
2007
 
Net revenues:
                             
IC Packaging
    20,127       20,033       21,644       59,387       55,956  
Testing
    5,195       5,102       5,282       15,191       14,331  
Others
    493       475       807       1,541       1,901  
Total net revenues
    25,815       25,610       27,733       76,119       72,188  
                                         
Cost of revenues
    19,186       19,098       19,303       56,790       52,358  
Gross profit
    6,629       6,512       8,430       19,329       19,830  
                                         
Operating expenses:
                                       
Research and development
    925       980       748       3,002       2,157  
Selling, general and administrative
    1,808       1,948       1,573       5,495       4,905  
Total operating expenses
    2,733       2,928       2,321       8,497       7,062  
Operating income
    3,896       3,584       6,109       10,832       12,768  
                                         
Net non-operating (income) expenses:
                                       
Interest expenses - net
    421       268       273       964       932  
Foreign exchange gain
    146       (294 )     (39 )     (449 )     (205 )
Gain on equity-method investment
    (69 )     (28 )     (111 )     (202 )     (250 )
Others
    244       76       157       520       595  
Total non-operating expenses
    742       22       280       833       1,072  
Income before tax
    3,154       3,562       5,829       9,999       11,696  
                                         
Income tax expense
    777       779       1,008       1,968       2,193  
Income from continuing operations and before minor interest
    2,377       2,783       4,821       8,031       9,503  
Minority interest
    165       371       596       1,071       1,042  
                                         
Net income
    2,212       2,412       4,225       6,960       8,461  
                                         
Per share data:
                                       
Earnings (loss) per share
                                       
– Basic
    NT$0.41       NT$0.44       NT$0.78       NT$1.29       NT$1.57  
– Diluted
    NT$0.41       NT$0.42       NT$0.76       NT$1.26       NT$1.53  
                                         
Earnings (loss) per equivalent ADS
                                       
– Basic
    US$0.067       US$0.073       US$0.119       US$0.207       US$0.238  
– Diluted
    US$0.066       US$0.070       US$0.116       US$0.203       US$0.232  
                                         
Number of weighted average shares  used in diluted EPS calculation (in thousands)
    5,403,832       5,663,514       5,596,982       5,489,339       5,617,306  
                                         
Exchange rate (NT$ per US$1)
    30.95       30.36       32.86       31.02       32.91  
 



Advanced Semiconductor Engineering, Inc.
Summary of Consolidated Balance Sheet Data
(In NT$ millions)
(Unaudited)
 
   
As of Sep. 30, 2008
   
As of Jun. 30, 2008
 
Current assets:
           
Cash and cash equivalents
    26,728       23,305  
Financial assets – current
    1,757       9,343  
Notes and accounts receivable
    17,875       17,633  
Inventories
    5,808       5,598  
Others
    3,423       3,232  
Total current assets
    55,591       59,111  
                 
Financial assets – non current
    4,554       4,568  
Properties – net
    84,953       82,965  
Others
    16,827       17,676  
Total assets
    161,925       164,320  
                 
Current liabilities:
               
Short-term debts – revolving credit
    10,956       12,906  
Short-term debts – current portion of long-term
debts
    2,958       5,712  
Short-term debts – current portion of bonds payable
    1,375       1,375  
Notes and accounts payable
    8,868       8,339  
Others
    10,077       19,492  
Total current liabilities
    34,234       47,824  
                 
Long-term debts
    51,078       40,663  
Long-term bonds payable
    0       4,031  
Other liabilities
    2,938       2,808  
Total liabilities
    88,250       95,326  
                 
Minority interest
    2,843       2,980  
                 
Shareholders’ equity
    70,832       66,014  
Total liabilities & shareholders’ equity
    161,925       164,320  
                 
                 
Current Ratio
    1.62       1.24  
Net Debt to Equity
    0.51       0.46