SAN JOSE, Calif. - May 28, 2024 - PRLog -- Adeia Inc., the company whose patented innovations enhance billions of devices, will share the latest developments in hybrid bonding technology during the premier advanced packaging conference, Electronic Components and Technology Conference (ECTC) at the Gaylord Rockies Resort and Convention Center in Denver, Colorado from May 28 to May 31, 2024.

The Adeia team will be on hand at booth #633 throughout the ECTC event to discuss the performance enhancement that hybrid bonding technology brings to 3D NAND, high bandwidth memory and chiplet integration and CMOS image sensor stacking.

Adeia experts will present papers during two technical sessions that will demonstrate new metrology techniques to improve assembly throughput and increase device yield of hybrid bond interconnect technology for manufacturing, as the industry is embracing this technology.

• Session 12: Artificial Intelligence and Advanced Modeling Approaches
  • Title: Deep Convolution Neural Networks for Automatic Detection of Defects Which Impact Hybrid Bonding Yield
  • Time: 3:45 p.m. MT on Wednesday, May 29
  • Authors: Drs. Oliver Zhao, Dominik Suwito, Bongsub Lee, Thomas Workman, Laura Mirkarimi
    
    
• Session 23: Novel Bonding Technology for Advanced Assembly Substrates and Integration
• Title: High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry
• Time: 4:45 p.m. MT on Thursday, May 30
• Authors: Drs. Bongsub Lee, Oliver Zhao, Arianna Avellán, Suhail Sadiq, Gill Fountain, Dominik Suwito, Guilian Gao, Laura Mirkarimi