Semiconductor Research Corporation (SRC) is proud to announce the release of the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, a comprehensive update to the industry’s first 3D semiconductor roadmap. This second edition reflects the contributions of over 370 experts from 132 organizations across industry, academia, and government, and builds upon the momentum of the original version released in October 2023.

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MAPT Roadmap 2.0 includes updated content and a new chapter on digital twins and their applications

The MAPT Roadmap version 2.0 outlines the “how” behind the 2030 Decadal Plan for Semiconductors, translating its five “seismic shifts”, or major development needs, into actionable strategies for innovation in chipmaking, heterogeneous integration, and workforce development. The roadmap is available at https://srcmapt.org, and is fully web-based to support dynamic updates and broader accessibility.

Funded by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST), the MAPT Roadmap 2.0 continues to support the CHIPS and Science Act by providing a strategic framework for building a robust semiconductor ecosystem.

“The MAPT Roadmap 2.0 is more than an update—it’s a reflection of the industry’s continued commitment to collaboration, innovation, and long-term impact,” said Dr. Victor Zhirnov, SRC Chief Scientist and Director of the MAPT Roadmap. “This edition expands our focus to include digital twins, workforce development, and data-centric manufacturing, aligning with the evolving needs of the semiconductor landscape.” Digital twin technology is a major focus of the SMART USA Institute, the public-private collaboration operated by SRC that is dedicated to increasing U.S. chip production efficiency, improving supply chain resiliency, and preparing the domestic semiconductor workforce.

"MAPT 2.0 reinforces SRC’s leadership in guiding the semiconductor industry through transformative change,” said Dr. Todd Younkin, President and CEO of SRC. “With this next chapter, SRC remains a driving force in shaping the future of industry-relevant semiconductor innovation and workforce development.”

What’s New in MAPT 2.0

• Expanded Participation: 370 contributors from 132 organizations
• New Chapter: Digital Twins & Applications
• Web-Based Platform: Fully online and continuously updated
• Strategic Timing: Released to coincide with annual planning cycles across government and industry, ensuring relevance and utility for current decision-making.

MAPT Roadmap 2.0 is a cornerstone of SRC’s broader strategy to transition toward the SMART USA Roadmap, which will focus on data-driven innovation and digital twin integration to assist the SMART USA Institute in its mission to deliver innovations and long-term commercial impact.

About SRC

Semiconductor Research Corporation (SRC) is a world-class, non-profit consortium that works with industry, government, and academia partners to define, fund and manage research and development on behalf of its member companies. Through its highly regarded programs, such as SMART USA, SRC plays an indispensable part in the strategies of the most influential industry leaders.

SMART USA Institute is the nation's first Manufacturing USA Institute focused on digital twin technology for semiconductor manufacturing. Led by the Semiconductor Research Corporation and supported by the National Institute of Standards and Technology CHIPS R&D Office with $285 million in federal funding matched by $720 million in planned private investment, SMART USA brings together industry, academia, and government to revitalize American semiconductor manufacturing through digital innovation.

Visit https://www.src.org/ and https://www.smartusatwins.org/ to learn more.

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The MAPT Roadmap 2.0 is more than an update—it’s a reflection of the industry’s continued commitment to collaboration, innovation, and long-term impact.